G07700 - SEMI G77 - Specification for Frame Cassette for 300 mm Wafers Revision:SEMI G77-0699 (Reapproved 0215) - Superseded Orders received during non-business hours

Orders received during non-business hours will be processed on the next business day (Monday-Friday

SEMI M53-1103 (technical revision)

This Document provides recommendations for addressing the problem of damage through closer examination of electric field as a supplement to existing static charge mitigation techniques

blend technique classification(s)

and monolithic integrated gas systems

G07700 - SEMI G77 - Specification for Frame Cassette for 300 mm Wafers Revision:SEMI G77-0699 (Reapproved 0215) - Superseded Orders received during non-business hours1 Purpose 1. 1 This Standard specifies the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die bonding process. 2 Scope 2. 1 This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. 2. 2 Only the physical interfaces for the frame cassette are specified; no materials